Silver Dendrite Hysteria returns after 20 years, Bad engineering and junk science lead to flurry of baseless law suits
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Video accompanied paper "Silver Dendritic Growth in Plastic IC Packages, presented by Mark Brodsky at 1984 International Society of Micro Electronics symposium Copyright 2004 Mark Brodsky All Rights Reserved
Silver Dendrites Attack Again: Suit ask $100 million

As Reported in the July, 2004 issue of Chipscale Review Magazine

In April 2003, Amkor Technologies was served with a cross-complaint in an action between Maxim Integrated Products, an IDM in Sunnyvale, Calif., and Philips. Fairchild Semiconductor has also sued Amkor over the reportedly faulty molding compound. The Sumitomo product has been associated with failures in ICs across the industry, in which silver dendrite growths form between adjacent pins, resulting in high-resistance shorts between the pins.

Maxim, reports millions of units made with the compound were shipped by the industry before the problem became widely known. The Sunnyvale-based semiconductor maker said it had not been able to reproduce the failure mechanism. "Circumstantial evidence, however, does suggest that there is a causal relationship.

Sumitomo said it began an investigation "in cooperation with customers" after receiving reports of the package problem. "However, we have not identified the root cause of the problem."

Based on information from customers, Sumitomo reported that the rate at which shorts were occurring was "extremely low compared to the size of total sales volume of the EME molding compound..."

Amkor disclosed that in 2002 it was named in a third-party suit in an action brought by Fujitsu Ltd. against Cirrus Logic. Fujitsu alleges that the ICs bought from Cirrus Logic and packaged by Amkor were defective due to the molding compound. Amkor has denied liability. That case is pending in the U.S. District Court for the Northern District of California, and seeks damages exceeding $100 million.

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